Hesse GmbH - Your partner for welding systems with ultrasonic and laser
 
Hesse GmbH, founded in 1995 and based in Paderborn, Germany, develops and manufactures fully automatic ultrasonic wire bonding and welding machines as well as laser welding systems together with standard or customer-specific automation solutions for the semiconductor industry backend.
Hesse GmbH is one of the world’s leading producers of wire bonders using the ultrasonic wedge-wedge technology and develops customer-specific production processes.
All relevant industrial companies engaged in assembly and connection technology (semiconductor manufacturers, HF/RF, automotive, battery systems supplier, medical etc.) are among the worldwide customers of Hesse GmbH.
Optimum local support for our customers, especially in the important markets such as Asia and America, is ensured by subsidiaries in Hong Kong, USA and Japan with their own Sales and Service for wire bonder. Furthermore, we have partner companies and co-operations in over 30 countries.
The core competencies of the company are mechatronic systems, ultrasonic technology and control engineering. Hesse GmbH is an expert in the detailed understanding and knowledge of the processes and physical effects relevant in ultrasonic and laser joining technologies.
We support our customers in developing and implementing individual process requirements with our HesseCustomerSoltutions; range of services:
- Pre-production prototype
- Small series production
- (Online) Services:
- Training
- Production support
- Process optimization
CONTACT:
Hesse GmbH
Lise-Meitner-Str. 5
33104 Paderborn
Deutschland
mail:Â info@hesse-mechatronics.com
tel: +49 5251 1560-0
web: Â https://www.hesse-mechatronics.com
